Internally damped circuit articles
US5552209A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 29, 1994 |
| Grant date | Sep 3, 1996 |
| Priority date | — |
| Expiry date | Jul 29, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method of improving the vibrational damping characteristics of a circuit article. The method involves adding damping layer(s) to the laminate material that is processed into a circuit article. The damping material effectively increases the damping of the circuit article and reduces the amplitude of resonant frequencies of the circuit article excited by environmental vibrations or shocks that the circuit board may encounter in use and thereby potentially improving the performance of the circuit article for vibration and shock related performance issues without the addition of add-on dampers to the circuit articles surface or by isolating the circuit board by means of vibration and shock isolators.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.