Surface-mounted fuse device
US5552757A · kind A · utility
38Cited by
27References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 1994 |
| Grant date | Sep 3, 1996 |
| Priority date | — |
| Expiry date | May 27, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polycarbonate adhesive. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.