Aqueous electroless plating solutions
US5554211A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 1995 |
| Grant date | Sep 10, 1996 |
| Priority date | — |
| Expiry date | Nov 15, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/382
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
It has now been found that one or more metals selected from the group consisting of tin, lead, bismuth, indium, gallium and germanium may be deposited onto a metal surface utilizing an aqueous electroless plating solution which comprises PA1 (A) at least one solution-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, a bismuth salt, an indium salt, a gallium salt and a germanium salt; PA1 (B) at least one acid selected from the group consisting of fluoboric acid, alkane sulfonic acids, alkanol sulfonic acids, and mixtures thereof; PA1 (C) a complexing agent which is an imidazole-2-thione compound of the Formula III ##STR1## wherein A and B are the same or different --RY groups wherein R is a linear, branched or cyclic hydrocarbylene group containing up to 12 carbon atoms, and Y is a hydrogen, halogen, cyano, vinyl, phenyl, or ether moiety; and PA1 (D) water. Optionally, the aqueous plating solutions may contain one or more surfactants.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.