Method of manufacturing electronic device and apparatus for manufacturing the same
US5554413A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1994 |
| Grant date | Sep 10, 1996 |
| Priority date | — |
| Expiry date | Jun 6, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C37/0075
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electron device-manufacturing method according to the invention comprises the steps of applying a resin coating layer, containing a solvent, to one of the surfaces of a substrate, directly or with a layer interposed therebetween; drying the resin coating layer to remove the solvent; and heating and pressing the resin coating layer to smooth the surface of the same. The method is characterized in that in the step of smoothing the surface of the resin coating layer, that side of the substrate on which the resin coating layer is not coated is mechanically supported by a supporting member, and a heating roller is brought into contact with the resin coating layer to press and heat the same, with another resin film interposed therebetween, which is thinner than the resin coating layer to be smoothed, thereafter releasing the interposed resin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.