Resist formation made by applying, drying and reflowing a suspension of photocurable material
US5554487A · kind A · utility
2Cited by
9References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1993 |
| Grant date | Sep 10, 1996 |
| Priority date | — |
| Expiry date | Oct 14, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1355
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for the formation of a patterned resist image upon a substrate comprises the steps of: (i) mechanically applying a layer of a suspension of a powdered solid photocurable material in a liquid carrier to the substrate; (ii) drying the resultant layer by evaporation of the liquid carrier and reflowing the powder, under the action of heat, to give a coherent film; (iii) imagewise exposing the dried film to radiation through a patterned mask whereby portions of the film exposed to radiation are cured; and (iv) subsequently developing the exposed film by removing unexposed portions thereof with an appropriate solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.