Method of forming solder film
US5556023A · kind A · utility
24Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1994 |
| Grant date | Sep 17, 1996 |
| Priority date | — |
| Expiry date | Oct 31, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12556
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is available for forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts which is capable of forming a precise and fine pattern. The method comprises selectively imparting tackiness to only a predetermined part of the metallic surface by use of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.