Apparatus and method for removing known good die using hot shear process
US5556024A · kind A · utility
13Cited by
16References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1994 |
| Grant date | Sep 17, 1996 |
| Priority date | — |
| Expiry date | Sep 29, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.