Patent · US Expired

Microporous thermal insulation molding

US5556689A · kind A · utility

24Cited by

2References

9Claims

0Family size

Assignees

Wacker Chemie AG · DE
Elektro-Ger atebau GmbH · DE

Inventors

G unter Kratel · Kempten (Allgäu), DE
G unter Stohr · Durach, DE
Martin Gross · Boone, US
Eugen Wilde · Knittlingen, DE

Key dates

Filing date	Mar 25, 1994
Grant date	Sep 17, 1996
Priority date	—
Expiry date	Mar 25, 2014

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24998
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A microporous thermal insulation molding comprising compressed thermal insulation material comprising 30-100% by weight of finely divided metal oxide, 0-50% by weight of opacifier, 0-50% by weight of fiber material and 0-15% by weight of inorganic binder, wherein at least one surface of the molding has channel pores having a cross-sectional area of the pore of 0.01-8 mm.sup.2 and having an intrusion depth of 5-100%, based on the thickness of the molding, with 0.004-10 channel pores being present per 1 cm.sup.2 of the molding surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.