Image-forming process
US5556735A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1994 |
| Grant date | Sep 17, 1996 |
| Priority date | — |
| Expiry date | Nov 30, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0793
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for the formation of a patterned resist of a photocurable material on a circuit board, the uncured portion of which is water soluble. The process includes the steps of forming a layer of an aqueous emulsion of a photocurable material upon the circuit board, drying the layer to a substantially dry and non-tacky state, imagewise exposing the layer to radiation to cure (harden) portions of the layer exposed to the radiation, and removing unexposed (uncured) portions of the layer by washing with water. In a preferred embodiment, the photocurable material is an organic solvent solution of an epoxy acrylate derived from an epoxy novolac resin which has been carboxylated to render it alkali-developable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.