Coaxial line assembly of a package for a high frequency element
US5557074A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Dec 8, 1994 |
| Grant date | Sep 17, 1996 |
| Priority date | — |
| Expiry date | Dec 8, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A coaxial line assembly in a package which houses a high frequency element. The assembly includes a metal wall having a hole extending through the metal wall. The metal wall has a step at substantially an intermediate portion of the hole to define a smaller diameter, inner hole portion opened to the inside of the package and a larger diameter, outer hole portion opened to the outside of the package. A lead for transmitting a high frequency signal passes through the hole and is hermetically sealed in the outer hole portion by glass filled in the outer hole portion. A sealing plate closes an opening of the inner hole portion at the step, the lead extending through the sealing plate. The sealing plate is made of a dielectric material having a dielectric constant near to that of the glass and a melting point higher than that of the glass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.