Heat dissipating arrangement in a portable computer
US5557500A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 1994 |
| Grant date | Sep 17, 1996 |
| Priority date | — |
| Expiry date | Dec 7, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipating arrangement in a portable computer uses a copper slug disposed between a heat-generating central processing unit (CPU) chip and the underside of a metallic keyboard baseplate. The slug also extends through a copper-plated hole in a printed circuit (PC) board, and is either soldered to the copper plating or press-fit into the hole to enhance heat transfer between the slug and the PC board. Small through-holes extend through the PC board and the copper plating next to the opening. These through-holes connect the copper plating to several layers of etch within the PC board, so that these layers act like fins on a heat sink to increase heat transfer away from the CPU.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.