Method of making a circuit board or layer thereof including semi-curing a second adhesive coated on a cured first adhesive
US5557843A · kind A · utility
16Cited by
47References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1994 |
| Grant date | Sep 24, 1996 |
| Priority date | — |
| Expiry date | Aug 30, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board and method of manufacture thereof is disclosed. The printed circuit board includes a first substrate provided from a conductive layer having disposed on a first surface thereof a cured adhesive layer, A semi-cured adhesive layer is then disposed over the cured adhesive layer and a second substrate is disposed against the semi-cured adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.