Automated thickness measurement system
US5557970A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 1995 |
| Grant date | Sep 24, 1996 |
| Priority date | — |
| Expiry date | Jul 3, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B17/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for and system of measuring the thickness of a component dimension f a sample material. Sound waves are coupled for transmission along a component direction of a sample material and also through first and second reference standards to provide first and second reference thicknesses. As the sound wave signal is transmitted, the time for the sound wave signal to traverse the sample thickness and the first and second reference thicknesses is measured. The thickness of the sample is calculated by calculating the velocity of the signal from the traverse times for the first and second reference thicknesses. Preferable, the calculations are made by a computer, and may be repeated over a period of time to calculate a change of thickness as a function of time. The computer may be used to compare the instantaneous thickness of the sample with at least one parameter such as information used to control a process, a predetermined minimum or maximum thickness a predetermined rate of change with respect to a minimum or maximum time, or a predetermined uneven change in thickness between a plurality of sample thicknesses. The sample may in fact comprise a plurality of locations on a tube, a…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.