Magnetostrictive pump for applying pastes and adhesives
US5558504A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 14, 1994 |
| Grant date | Sep 24, 1996 |
| Priority date | — |
| Expiry date | Nov 14, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A device is proposed for applying material such as solder paste and glue in discrete points, particularly for applying solder paste on electronic circuit boards. The device comprises a pump house (202-205; 301, 307), a tube or a channel (206) by means of which material is fed to the pump house, a nozzle (111, 205) for feeding material from the pump house (202-205; 301, 307). Suitable upper and lower valve devices are arranged to block, at predetermined times, the feeding of material to and from the pump house (202-205; 301, 307). The lower valve device may possibly be replaced by a restriction device. As is conventional the pump house (202-205; 301, 307) comprises an outer pump cylinder (203; 307) and an inner piston (204; 301). The displacement of the piston (201; 301) is obtained by the fact that the piston is connected to a magnetostrictive rod (202; 308). This rod (202; 308) cooperates with a coil (208) arranged around the rod (202; 308). When an electric current is fed to this coil (208) the length of the rod will increase. A very rapid application of the material is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.