Rapid response vapor source
US5558720A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jan 11, 1996 |
| Grant date | Sep 24, 1996 |
| Priority date | — |
| Expiry date | Jan 11, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/243
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The apparatus is a rapid response evaporator for material deposition in vapor. The structure is a vessel which is heated to a temperature just above the melting temperature of the liquid which it contains. Inserted into the heated liquid is a funnel shaped evaporator structure in which the vertical tube is a capillary structure to raise the heated liquid from the vessel. The upper diverging portion of the evaporator contains a porous capillary interior coating in contact with the capillary tube, and the exterior is independently heated. Because of the low thermal mass of the upper portion of the evaporator and the liquid in its capillary structure, it can respond to heat changes quickly enough to rapidly vary the rate of evaporation and the thickness of the deposited coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.