Hot melt adhesives for bonding to sensitive areas of the human body
US5559165A · kind A · utility
84Cited by
21References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 8, 1995 |
| Grant date | Sep 24, 1996 |
| Priority date | — |
| Expiry date | Aug 8, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A pressure sensitive hot melt adhesive comprising a block copolymer and 60 to 95 parts of a liquid diluent, the adhesive being characterized by a midblock Tg less than -10.degree. C., a G' less than 15.times.10.sup.4 dynes/cm.sup.2 at 10 rad/s, 25.degree. C., a G" of 1 to 6.times.10.sup.4 dynes/cm.sup.2 and a tensile strength greater than 10 psi exhibit superior properties, without the need for any curing operation after cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.