Semiconductor device including a plurality of leads each having two end portions extending downward and upward
US5559365A · kind A · utility
2Cited by
2References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 28, 1994 |
| Grant date | Sep 24, 1996 |
| Priority date | — |
| Expiry date | Dec 28, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a semiconductor device having a terminal bend protecting frame formed in the terminal tip parts by filling the spaces between the lead terminals with a resin of the same quality as that of the sealing resin. In other words, each of lead terminals led from a package has a first end portion extending upward and a second end portion extending downward.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.