Electroless gold plating solution
US5560764A · kind A · utility
2Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1995 |
| Grant date | Oct 1, 1996 |
| Priority date | — |
| Expiry date | Aug 14, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides an electroless gold plating solution which offers deposition layers exactly onto predetermined areas on the surface of the workpiece, without undesirable spread of prated areas. The electroless gold plating solution according to the invention contains 2-20 g/l of dimethylamine as amine group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.