Process for manufacturing a printed circuit board and printed circuit board
US5560795A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 1994 |
| Grant date | Oct 1, 1996 |
| Priority date | — |
| Expiry date | Aug 2, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1093
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Producing a printed circuit board having at least two layers and having a carrier board, a first Conductor layer having contact areas and a second conductor layer having connecting areas, in which a conductive foil, provided with an adhesive coating, is laminated onto the carrier board having the first conductor layer and the contact areas, the adhesive coating an the conductive foal having holes which correspond with the contact areas of the first conductor layer. The perforated conductive foil, provided with the adhesive coating, is compressed and laminated with the carrier board having the first conductor layer, the contact areas of the first conductor layer being bulged at least partially through the holes in the adhesive coating in the direction of the surface of the connecting areas of the second conductor layer so that the surfaces of the contact areas are in each case at a distance from the surface of the connecting areas of the second conductor layer which is less than the thickness of the connecting areas. Subsequently, the second conductor layer having the connecting areas is produced from the conductive foil, the connecting areas of the second conductor layer bounding t…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.