Polyphenylene ether/polyamide molding materials

US5561193A · kind A · utility

Assignee

• BASF SE

Inventors

• Axel Gottschalk · Neustadt, DE
• Herbert Fisch · Monsheim, DE
• Gunter Pipper · Bad Dürkheim, DE
• Martin Weber · Maikammer, DE

Key dates

• Filing date: Apr 17, 1995
• Grant date: Oct 1, 1996
• Expiry date: Apr 17, 2015

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L71/12
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding materials contain A) from 5 to 95% by weight of a partly aromatic, semicrystalline copolyamide composed essentially of PA1 a.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid PA1 a.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid PA1 a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine and PA1 a.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms, the molar percentages of components a.sub.1) to a.sub.4) together being 100%, and B) from 5 to 95% by weight of a polyphenylene ether C) from 0 to 30% by weight of an elastomeric polymer, D) from 0 to 45% by weight of a fibrous or particulate filler or of a mixture thereof, E) from 0 to 20% by weight of a flameproofing agent and F) from 0 to 30% by weight of conventional additives and processing assistants, the percentages A) to F) summing to 100%.