Silicone pressure sensitive adhesive composition
US5561203A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 1995 |
| Grant date | Oct 1, 1996 |
| Priority date | — |
| Expiry date | Apr 13, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/44
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Silicone pressure sensitive compositions that combine high ultimate strength in a cured network with a lower modulus and have improved adhesive strength at elevated temperatures are disclosed. The pressure sensitive adhesive compositions are comprised of (A) a soluble, capped, organopolysiloxane resin containing less than 1.2 weight percent silicon-bonded hydroxyl groups based on the total weight of (A); (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least two silicon-bonded hydrolyzable radicals said polymer having a viscosity at 25.degree. C. of 20 to 100,000 mm.sup.2 /s; and (C) a hydrolyzable silane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.