Method for connecting electronic circuits in a multi-chip module having a co-fired substrate and multi-chip module obtained thereby
US5562837A · kind A · utility
7Cited by
2References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 8, 1995 |
| Grant date | Oct 8, 1996 |
| Priority date | — |
| Expiry date | Feb 8, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The multi-chip module comprises a co-fired substrate, and, on at least ont face of the substrate, a set of superimposed ceramic insulating layers, fired at a temperature substantially smaller than the firing temperature of the substrate. Conducting interconnection lines are formed in thick layers deposited between said ceramic insulating layers. Electronic components are mounted at the surface of the set of ceramic layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.