Substrate reclaim method

US5562840A · kind A · utility

Assignee

• Xerox Corporation · US

Inventors

• Eugene A. Swain · Webster, US
• Peter Schmitt · Erlangen, DE
• Alfred O. Klein · Rochester, US
• John J. Wilbert · Macedon, US

Key dates

• Filing date: Jan 23, 1995
• Grant date: Oct 8, 1996
• Expiry date: Jan 23, 2015

Classification

• Technology area (CPC G): Physics
• CPC primary: G03G5/102
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

There is disclosed a substrate reclaim method comprising directing laser energy at a coating covering a part of an outer surface of a substrate, wherein the outer surface has a shiny finish, thereby removing with the laser energy all of the coating on the outer surface and etching with the laser energy a portion of the outer surface to change the etched outer surface portion from a shiny finish to a matte finish.