Transportable object and process of production
US5563444A · kind A · utility
5Cited by
2References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 1994 |
| Grant date | Oct 8, 1996 |
| Priority date | — |
| Expiry date | Apr 6, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A transportable object having, in a plastic support, a cavity for receiving a micromodule unit containing a conductive chip with zones electrically insulated from one another and to which is electrically connected an integrated semiconductor circuit having at least a storage function. The cavity has a contour shaped in a sequence of contiguous arcs of small amplitude relative to a median contour line of a shape matched to the shape of the chip. The contour of the cavity forms a clearance angle of 10 degrees relative to a direction perpendicular to the surface of support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.