Transparent heat protection element
US5565273A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1994 |
| Grant date | Oct 15, 1996 |
| Priority date | — |
| Expiry date | Jul 15, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/921
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The heat protection element comprises carrier elements, for example in the form of glass plates. In an interspace between, in each instance, two glass plates a protection layer comprising a cured polysilicate which is formed of alkali silicate and at least one curing agent is disposed. In the polysilicate, a molar ratio of silicon dioxide to alkali metal oxide is set to be greater than 4:1. The starting composition for the polysilicate is a free-flowable composition having a water content of up to 60 percent and capable of being introduced into the interspace between two carrier elements. After curing the composition, the high water content is retained and the polysilicate has nevertheless good inherent strength and adhesion on the carrier elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.