LSI package board
US5565706A · kind A · utility
115Cited by
7References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1995 |
| Grant date | Oct 15, 1996 |
| Priority date | — |
| Expiry date | Mar 20, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer of the LSIs is formed, providing a thin package board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.