Laser module including grooved silicon substrate, isolator and optical fiber
US5566264A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 1995 |
| Grant date | Oct 15, 1996 |
| Priority date | — |
| Expiry date | Aug 25, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02326
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The laser module couples its semiconductor laser to an optical device, e.g. an optical fiber, particularly a monomode fiber. The laser module includes a micromechanically structured silicon substrate (31) provided with an elongated groove (30) having a longitudinal axis by an anisotropic etching technique; a semiconductor laser (110) mounted on the silicon substrate (31) to emit light parallel to the longitudinal axis of the elongated groove; an optical coupling device including an isolator (10) positioned on the silicon substrate (31) so that light from the semiconductor laser (110) passes therethrough and a sealed housing (50) inside of which the silicon subtrate (31), the semiconductor laser (110) and the isolator are contained. At least a portion of the optical components mounted in the elongated groove and not rotationally symmetrical with respect to forward light transmission properties are each provided with at least one flat edge surface (210,210') bearing on an anisotropically etched wall of the elongated groove (30).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.