Attaching an electronic circuit to a substrate
US5566441A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1994 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Mar 11, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Integrated circuits such as transponders are attached to a substrate such as cardboard packaging material by adhering an integrated circuit in the substrate, applying a patch antenna to the substrate and the integrated circuit, and applying a sealing layer over the integrated circuit and at least a portion of the antenna. In variations of the method, an indentation may be formed in the substrate into which the integrated circuit is placed. The patch antenna may be screen printed onto the substrate and the integrated circuit, using conductive ink, or may be a metallic foil which is applied to the substrate and the integrated circuit. Where the integrated circuit is a transponder, it can be programmed with an identification code, either before or after being attached to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.