Stamped and formed heat sink
US5566749A · kind A · utility
30Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 1995 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Oct 10, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stamped and formed heat sink has a thermally conductive body including a base having a face adapted for attachment to an electronic device package. Stamped and formed heat dissipation elements extend from the edges of the base perpendicular to the base. The heat sink is formed in a progressive punch and die press so that a heat sink is produced on every stroke.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.