Workpiece holder for rotary grinding machines for grinding semiconductor wafers, and method of positioning the workpiece holder
US5567199A · kind A · utility
27Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1994 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Sep 21, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A workpiece holder for rotary grinding machines for grinding semiconductor afers has a rotatable work surface which points toward a rotating grinding tool and on which the semiconductor wafer to be machined is laid, and has piezoelectric elements on which the workpiece holder is axially supported. The piezoelectric elements can be operated independently of one another and, when operated, undergo a change in their linear dimension, an operated piezoelectric element axially raising or lowering the workpiece holder at the point at which it supports the workpiece holder. There is also a method for positioning the workpiece holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.