Polishing pad with abrasive particles in a non-porous binder
US5567503A · kind A · utility
77Cited by
17References
10Claims
0Family size
Inventors
Key dates
| Filing date | Sep 19, 1994 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Sep 19, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad comprises a carrier and layer of a non-porous thermoplastic polymer secured to a surface thereof and containing a mass of discrete abrasive particles, comprising diamond or cubic boron nitride, uniformly dispersed therein. The abrasive particles have a particle size of up to 500 microns and are present in the layer in a concentration of up to 30 volume percent. The layer presents an abrasive polishing surface. The abrasive layer may also comprise a plurality of spaced strips secured to a surface of the carrier and each strip presents an abrasive polishing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.