Semiconductor device-encapsulating epoxy resin composition
US5567749A · kind A · utility
30Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1994 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Oct 25, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.