Bonding pad structure having an interposed rigid layer
US5567981A · kind A · utility
25Cited by
13References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1993 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Mar 31, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.