Heat sink
US5567986A · kind A · utility
20Cited by
1References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 27, 1994 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | May 27, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink is provided wherein a heat receiving plate and at least one piece of heat radiating fin are stacked in the heat sink, and an interval between the heat receiving plate and fin is maintained by a number of bosses geometrically disposed on the heat radiating fin. The bottom of each boss is soldered onto the adjacent heat receiving plate or heat radiating fin. The heat sink therefore is provided with a plurality of conductive contacts between said fins and said heat receiving plate in the radial or transverse direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.