Thermal print head
US5568175A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1995 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Nov 6, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J29/377
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal print head, including a resistance substrate having a front and rear surface, a plurality of heating elements formed on the front surface of the resistance substrate for converting electrical energy into heat energy, a cooling board for dissipating heat generated from the heating elements and the resistance substrate, wherein the cooling board is divided into separable first and second parts, the first part being disposed opposite the rear surface of the resistance substrate and below the heating elements; and a cooling compound with high thermal conductivity inserted between the first part of the cooling board and the rear surface of the resistance substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.