Thermal print head and method of making the same
US5568176A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1995 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Nov 20, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J29/377
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal print head and method of creating the same, in which a metal film and a cooling compound are inserted between a resistance substrate and a cooling board. This construction can prevent the formation of air bubbles in the cooling compound between the resistance substrate and the cooling compound. This construction can also reduce local heat accumulation and thereby reduce uneven priming contrast since even if an air bubble is formed it will have a thickness less than the thickness of a double-sided tape that acts as an adhesive between the resistance substrate and the cooling board. In addition, a clearer image can be obtained even in the hi-speed priming because the metal film having a thermal conductivity higher than that of the cooling compound is inserted inside the cooling compound. This increases the overall thermal conductivity between the resistance substrate and the cooling board and thus improves heat dissipation within the system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.