Sonically-bonded outer support structure for an integrated circuit card
US5568364A · kind A · utility
10Cited by
11References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 8, 1994 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Dec 8, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0273
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A integrated circuit card having a rigidized frame to surround the electronic devices on a printed circuit (PC) board. The card includes a frame and integral cover for the top and bottom. The top and bottom are constructed out of a material that does not interfere with the use of an antenna coupled to the board assembly within the card. The bottom and top are coupled together using pins. When the two are coupled together the frame is better supported.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.