Modulator-based photonic chip-to-chip interconnections for dense three-dimensional multichip module integration
US5568574A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1995 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Jun 12, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03H1/0808
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Computation-intensive applications such as sensor signal processing, sensor fusion, image processing, feature identification, pattern recognition, and early vision place stringent requirements on the computational capacity, size, weight, and power dissipation of modular computational systems intended for both embedded and high performance computer environments. Such ultra high speed, ultra high density computational modules will typically be configured with multiple processor, memory, dedicated sensor, and digital signal processing chips in close-packed multichip modules. The present invention relates to a novel architecture and associated apparatus for the development of highly multiplexed photonic interconnections between pairs of such electronic chips incorporated in vertical stacks within three-dimensional multichip module configurations. Vertical signal transmission through the chip substrates is accomplished by using a planar-waveguide-based optical power bus to provide a parallel array of beams to read out a modulator array that is flip-chip bonded to each silicon substrate. Local and quasi-local connectivity in the vertical dimension is accomplished by using diffractive opt…
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