Low-temperature hermetic sealing of optical fiber components
US5568585A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 13, 1995 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Mar 13, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4248
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for manufacturing low-temperature hermetically sealed optical fi components is provided. The method comprises the steps of: inserting an optical fiber into a housing, the optical fiber having a glass core, a glass cladding and a protective buffer layer disposed around the core and cladding; heating the housing to a predetermined temperature, the predetermined temperature being below a melting point for the protective buffer layer and above a melting point of a solder; placing the solder in communication with the heated housing to allow the solder to form an eutectic and thereby fill a gap between the interior of the housing and the optical fiber; and cooling the housing to allow the solder to form a hermetic compression seal between the housing and the optical fiber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.