Polishing apparatus
US5569063A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1995 |
| Grant date | Oct 29, 1996 |
| Priority date | — |
| Expiry date | Jul 6, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/004
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus, for polishing/cleaning a target object surface by using a polishing tape, has a spindle rotatably placed inside an opening formed in a base plate, a motor for rotating the spindle, a compression roller rotatably supported between a pair of side walls attached to the spindle, supply and take-up rollers supported rotatably by the side walls for advancing the polishing tape, and a motor for the take-up roller. The polishing tape is supplied from the supply roller and taken up by the take-up roller through the compression roller, while rotating around with the spindle. The compression roller has a smaller diameter at its center part than at its end parts for preventing the polishing tape from becoming twisted or wrinkled when the compression roller is rotated by the motion of the spindle while being pressed against a target object and being advanced from the supply roller to the take-up roller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.