Inorganic liquid filler compositions for consolidation/sealing of ground formations and building materials
US5569323A · kind A · utility
3Cited by
4References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 1994 |
| Grant date | Oct 29, 1996 |
| Priority date | — |
| Expiry date | May 23, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W30/91
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Inorganic liquid filler compositions, well suited for the sealing or consolidation of ground formations or construction/building materials by injecting such composition into the fissures, cavities or interstices thereof (void volume) and permitting the composition to harden, comprise a homogeneous solution of (i) an alkali metal silicate, (ii) an alkali metal polyphosphate and (iii) an alkali metal aluminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.