Integrated circuit micromodule obtained by the continuous assembly of patterned strips
US5569879A · kind A · utility
97Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1995 |
| Grant date | Oct 29, 1996 |
| Priority date | — |
| Expiry date | Mar 30, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1737
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A micromodule includes a slotted metal strip and a perforated dielectric strip having a thickness of less than 70 micrometers, preferably between 30 and 50 micrometers. The metal strip is bonded to the dielectric strip so as to overlie the slots in the metal strip. A chip is bonded to the dielectric strip and connected to the metal strip through the perforations in the dielectric strip. An insulating resin layer encapsulates the chip and is bonded to the dielectric strip. The micromodule may be used, for example, in a smart card, as a radiating antenna, or as an identification label.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.