Device to monitor and control the temperature of electronic chips to enhance reliability
US5569950A · kind A · utility
83Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 1995 |
| Grant date | Oct 29, 1996 |
| Priority date | — |
| Expiry date | Nov 28, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Device to monitor and control the temperature of electronic chips to enhance reliability including a thermal electric cooling device in which the cold side is thermally secured to the chip and the hot side is attached to a heat sink. A thermocouple is sandwiched between the TEC device and the chip and a feedback control circuit is connected between the thermocouple and the voltage source which applies a potential to the TEC device to maintain the chip at the desired substantially constant temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.