Patent · US Expired

Coil former with injection-molded encapsulation

US5570075A · kind A · utility

7Cited by

3References

4Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Erwin Krimmer · Plüderhausen, DE
Richard Lorenz · Seguin, US
Tilman Miehle · Weingarten, DE
Steffen Schumacher · Renningen, DE

Key dates

Filing date	Jun 7, 1995
Grant date	Oct 29, 1996
Priority date	—
Expiry date	Jun 7, 2015

Classification

Technology area (CPC H)Electricity
CPC primaryH01F5/04
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A coil former with injection-molded encapsulation has a top fitting in which coil wire guides for guiding a coil wire are formed. By virtue of the specific shape and arrangement of the coil wire guides, it is ensured, in particular together with a special design of the housing which surrounds the coil former, that the coil wire is only stressed in its longitudinal direction. As a result, damage or preliminary damage of the coil wire is prevented and reliability is increased.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.