Heat sink assemblies
US5570271A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 3, 1995 |
| Grant date | Oct 29, 1996 |
| Priority date | — |
| Expiry date | Mar 3, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly made up of a heat sink, an electrical component adapted for mounting to a region of a printed circuit board mounted and, a clip. The clip includes a planar horizontal section, a pair of vertically extending legs disposed along folds formed at opposing ends of the horizontal section and, an engaging section disposed along an edge of the horizontal section and positioned intermediate the opposing ends of the horizontal section. The engaging section is adapted engage the heat sink and force the heat sink against the printed circuit board mounted electrical component as the legs of the clip engage the printed circuit board through holes formed in the printed circuit board on opposing sides of the component mounting region of the printed circuit board. A pair of gussets, is disposed at the folds formed at the opposing ends of the horizontal section. The gussets are provided to "lock in" the bend between the legs and the horizontal section at 90 degrees. The planar horizontal section, the pair of vertically extending legs, the gussets and the vertically extending, engaging section of the clip are a integrally formed from a single material, preferably sheet metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.