High density multichip module packaging structure
US5570274A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 1994 |
| Grant date | Oct 29, 1996 |
| Priority date | — |
| Expiry date | Nov 29, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multichip module packaging structure provided over a mother board. A multichip module substrate is mounted over the mother board through a frame member. The frame member is provided to extend successively on a peripheral region of a bottom surface of the substrate and further extend downward from the bottom surface of the substrate. The frame member also has a top portion bonded with the bottom surface of the substrate and a bottom portion bonded with the top surface of the mother substrate so as to form a three dimensional space surrounded by the frame member, the substrate and the mother board. A plurality of semiconductor integrated circuit chips are provided on the bottom surface of the substrate so that the chips are accommodated within the three dimensional space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.