Method for mounting components and apparatus therefor
US5570993A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 1993 |
| Grant date | Nov 5, 1996 |
| Priority date | — |
| Expiry date | Aug 9, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component mounting device adapted to mount components such IC or the like on a printed circuit board that includes replaceable pick up nozzles to accommodate different types of components to be picked up. A sensing station is provided that permits the pick up nozzle to be verified as the correct one and also to determine, if desired, its orientation and misalignments in its axis of rotation so as to permit adjustment in the mounted to accommodate for errors. In addition, a reference height position may be set so that the same sensing station can be employed to sense both the orientation of a component that is picked up and also whether the component is correctly oriented for deposit. This is done by measuring projected lengths in a plane with a photo sensitive device and by making calculations in accordance with trigonometric relationships.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.