Gel-forming silicone composition
US5571853A · kind A · utility
24Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 1995 |
| Grant date | Nov 5, 1996 |
| Priority date | — |
| Expiry date | Jul 20, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A gel-forming silicone composition comprising (A) an organopolysiloxane containing a silicon-bonded alkenyl group or groups in an average amount of from 0.15 to 0.35 mol % based on all silicon-bonded organic groups contained per molecule, (B) a non-functional organopolysiloxane, (C) an organohydrogenpolysiloxane containing an average of 2 silicon-bonded hydrogen atoms per molecule, and (D) an addition reaction catalyst. The silicone composition is able to give a gel-like cured silicone product with low modulus of elasticity while retaining flexibility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.