Plenum bypass serial fan cooling subsystem for computer systems
US5572403A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 18, 1995 |
| Grant date | Nov 5, 1996 |
| Priority date | — |
| Expiry date | Jan 18, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A cooling subsystem and method for a chassis of a computer system. The cooling subsystem comprises: (1) first and second cooling fans having first and second motors associated therewith for driving the first and second cooling fans, respectively and (2) a common plenum substantially shrouding and providing a pathway for air communication between the first and second cooling fans, the first and second fans cooperating to provide an optimum rate of air flow from without the chassis to within the chassis to provide air exchange within the chassis, the air flow within the chassis being in a predetermined direction to provide directed cooling of a specified device within the chassis, the common plenum allowing the first and second fans to continue to cooperate to provide a minimum air flow to provide a minimum air exchange within the chassis, the air flow remaining in the predetermined direction to continue the directed cooling of the specified device when a selected one of the first and second motors fails. The plenum comprises a bypass aperture therein for allowing the air to alternatively enter and exit the plenum, the bypass aperture increasing a rate of air flow across the subsyste…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.