Auto-regulating solder composition
US5573859A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 5, 1995 |
| Grant date | Nov 12, 1996 |
| Priority date | — |
| Expiry date | Sep 5, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12132
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A soldering composition is self melting and is auto-regulating. The solder composition (100) has a central core (102) made from a non-magnetic metal. A coating (105) of a magnetic material surrounds most or all of the central core. A solder layer (108) overlies the coating of magnetic material, and the solder layer has a melting temperature that is lower than the Curie temperature of the magnetic material. The auto-regulating temperature substantially corresponds to the Curie temperature. When the solder composition is placed in a field of alternating current, the magnetic material heats up and melts the solder coating. When the Curie temperature is reached, the magnetic material stops heating, thus controlling the maximum temperature of the soldering composition. As the temperature of the composition drops below the Curie temperature, the magnetic material again heats up, thus keeping the temperature of the solder constant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.